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PRODUCT/PROCESS CHANGE NOTIFICATION
PCN DSG-COM/03/145
PCN LEADFREE PLATING FOR SO8 PACKAGE IN MUAR first lines
2003/02/7
PCN DSG-COM/03/145 Product Family /Commercial Product Type Of Change Reason For Change Description of the change STANDARD LINEAR products in SO8 package Package assembly process change Environmental directive To remove lead from plating by using preplating nickel palladium gold leadframe NiPdAu. This change will not affect ELECTRICAL & MECHANICAL parameters. Samples available: LM393DT/LM358DT. Other samples: on request. PLEASE BOOK YOUR SAMPLE ORDER IN NON-STANDARD WITH THE FOLLOWING COMMENT "AS PER LEADFREE PCN DSG-COM/03/145". Forecasted date of change Forecasted date of samples for customer Forecasted date for STMicroelectronics change qualification report availability Marking to identify changed product Description of qualification program Product Line(s) and/or Part Number(s) Manufacturing Location(s) Estimated Date of first shipment Division Product Manager Division Q.A. Manager 07-May-2003 Jean Claude KAIRE Francoise PACCARD Date: Jan.29 ,03 Date: Jan.29 ,03 07-May-2003 07-Feb-2003 07-Feb-2003
"E" letter on the package close to ST LOGO See Attached Qualification Plan See Attached List
Customer Acknowledgement of Receipt Please sign and return to STMicroelectronics Sales Office Qualification Plan Denied Qualification Plan Approved Name: Title: Company: Change Denied Change Approved Remark Date: Signature:
PCN DSG-COM/03/145
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Process Change/ Transfer Qualification report n QASO8N91
PROCESS CHANGE / TRANSFER QUALIFICATION REPORT
PCN reference: DSG-COM/03/145 Qualification Report n: QASO8N91 Qualification Type: Material change Process: Leadfree plating New glue Hitachi 4900 Date of issue: 22th January 2003
Reference documents:
SOP 2.5.9 Process critical and key parameters 0076604 Process Qualification and release to production 0078588 Reliability requirements for product qualification 0046008 Process control plan for Front End 0060531 FMEA procedure 0061050 Back end qualification procedure 0091984 Construction analysis 0037709 Package construction analysis 7006451 Management of manufacturing source change 0033689 Process flow chart
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Process Change/ Transfer Qualification report n QASO8N91
Content
1 PROCESS MAIN SPECIFICATION CHANGE 1.1 Process change description 1.2 Process main specification change 1.3 Possible effects of change on Parametric, Electrical, Quality or Reliability
2 QUALIFICATION PLAN 2.1 Test vehicle description 2.2 Process qualification requirements 2.3 E WS qualification requirements 2.4 Final Test qualification requirements 2.5 Bench Test requirements 2.6 Reliability qualification requirements
3 QUALIFICATION RESULTS 3.1 Process qualification results 3.2 EWS qualification results 3.3 Final Test qualification results 3.4 Bench Test qualification results 3.5 Reliability qualification results
4 PROCESS CHANGE QUALIFICATION CERTIFICATE
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Process Change/ Transfer Qualification report n QASO8N91
1. PROCESS MAIN SPECIFI CATION CHANGE 1.1 Process change description.
1.1.1 Nature of Change: Leadfree plating NiPdAu preplated leadframe and glue change (Hitachi 4900) 1.1.2 Reason for Change: To be compliant with Environmental directives. 1.1.3 Affected process: SO8 assembled in ST Muar 1.1.4 Affected products: All standard linear devices assembled in SO8
1.1.5
Implementation date: April 2003
1.2 DETAILLED DESCRIPTION OF CHANGE
New Process Assembly site Assembly flow + Control Plan Frame (material) Die attach material Wire material Wire diameter Mold compound Wire bond method Lead finishing ST Muar (Malaysia) 7124337 Copper + NiPdAu preplating Hitachi 4900ST Gold 1 MIL MP8000 CH4 Thermosonic NiPdAu (preplated)
Current Process ST Muar (Malaysia) 7071671 Copper Ablebond 8390 Gold 1 MIL MP8000 CH4 Thermosonic Tin plating (SnPb85/15)
LEAD-FREE components are defined by STMicroelectronics as ECOPACK(R) components.
The implementation of the ECOPACK specification includes the suppression of lead (Pb) in those alloys used the lead finishing of components. The identification of ECOPACK products will be achieved through specific labelling on component boxes. Whenever possible, the letter "E" will be added in the marking pattern beside the ST logo on the package body. 1.3 MAJOR EFFECTS OF CHANGE ON QUALITY, PARAMETRIC, ELECTRICAL OR RELIABILITY DATA
No effect on solderability: ECOPACK components a re solderable with both current SnPb and AgSnCu lead free PCB assembly processes.
Reliability improvement: In addition to the change of connection coating, a change in materials (glue) occurs
in SO Narrow in order to meet the higher soldering tem perature constraints required for lead-free soldering using, in particular, the IPC/JEDEC JSTD020B standard as reference.
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Process Change/ Transfer Qualification report n QASO8N91
2. QUALIFICATION PLAN 2.1 PROCESS QUALIFICATION REQUIREMENTS 2.1.1 Flow Chart comparison (1) 2.1.2 Control Plan comparison (1) 2.1.3 FMEA study (1) 2.1.4 Process construction analysis (1) 2.1.5 Quantity of qualification lots [ ]1 yes [ X ] yes [ X ] yes [ X ] yes [ X ] [ ]2 yes [X ] no [ ] no [ ] no [ ] no [ ] [X ]3 no [ ] [ ]4 N/A [ ] N/A [ ] N/A [ ] N/A [ ] N/A [ ]
2.1.6 Critical parametric parameters analysis (Cpk) Bond pull test, Bond shear test. 2.1.7 Non critical parameters analysis (Mean)
yes [X ]
no [ ]
N/A [ ]
Note 1: as described in related ADCS procedure
2.2 Test Vehicles (TV) description. Line
0431* 0158* 0082*
Sales Type
TL431CD LM358D TL082CD
P&L
71 71 71
Dice size
1.38x1.12mm 1.07x 1.01 1.74x1.48
Package
SO8 SO8 SO8
Assy
ST Muar ST Muar ST Muar
Reliab plant
Grenoble +Muar Grenoble Muar
Lot # 1 1 1
* shrinked die version 2.3 FINAL TEST QUALIFICATION REQUIREMENTS 2.3.1 Quantity of qualification lots 2.3.2 Lot average yield data: 2.3.3 Package type 2.3.4 Parameter distributions 2.3.4.1List of parameters: 2.3.4.2 Qualification criteria: N/A 2.4 BENCH MEASUREMENTS QUALIFICATION REQUIREMENTS
[ X] yes [ ] no [ ]N/A
[ x ] yes []3 []3
[ ] no
[]1 []1 SO8 [X ] N/A
[X ] 2 [X ]2
[ ] LotA [ ] LotB
[ ] Lot C
Construction analysis conforms to ST specification.
2.5 SPECIFIC TESTS QUALIFICATION REQUIREMENTS [] yes 2.5.1 ESD 2.5.1 Latch-up
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[ ] no
[x] N/A
[] yes [] yes
[ x ] no [ x ] no
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Process Change/ Transfer Qualification report n QASO8N91
2.6 RELIABILITY QUALIFICATION REQUIREMENTS 2.6.1 Reliability tests performed on 2.6.2 Reliability tests: Tests HTB Conditions Ta=125C Vs=absolute max rating PPT 3 atm. + TMC Ta=85C RH=85pct Vs=nominal Test 1000h [x] LotA [x] LotB
[x] yes [x] LotC
[] no
Environment Sequence THB
48h 100 cy. 1000h
LotA LotB LotC Comments X X X Purpose: to point out problems connected to electrical stress related with the field application condition X X X X X X Purpose: To point out failure mechanism mainly due to electrochemical effects developped inside the device for contamination ions and electrical field applied Purpose: to point out the thermomechanical mismatch among the different materials employed Purpose: to point out critical water entry path with consequential electrolytic and galvanic corrosion. Purpose: To point out problem connected to the reflow soldering.
TMC
Ta= -65/+150C
1000c
X
X
X
PPT
Ta=121C P=2atm
480h
X
X
X
Jedel level determination
TMSK
Jedel level 1 168h 85C / 85%RH + 3IR reflow soldering Ta= -65/+150C
X*
X**
X**
500shk
X
X
Purpose: to point out the thermomechanical mismatch among the different materials employed
* With 260C reflow peak (see Appendix 1) ** With 245C reflow peak (see Appendix 1) 2.6.3 Drift analysis on Vio parameter (HTB & THB) 2.6.4 Qu alification criteria: no reject after reliability. [x yes [ ] no
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Process Change/ Transfer Qualification report n QASO8N91
3. QUALIFICATION RESULTS 3.1 Process qualification results. Bond Pull Test
Device TL431CD LM358CD Wire size 1.0mil 1.0 mil Min 8.3g 8.5g Max 14.4g 12.7g Average 10.9 10.5 Stdev 1.34 1.26 Cpk 1.72 1.71 comments Minimum specification: 4g
Bond shear test
Device TL431CD LM358CD Wire size 1.0mil 1.0 mil Min 45.0g 43.2g Max 65.4g 60.8g Average 57.2 53.1 Stdev 5.72 5.04 Cpk 1.94 1.92 comments Minimum specification: 32g
3.2 Bench Test qualification results 3.2.1 X-ray analysis Wire sweeping conform No glue void 3.2.2 External visual NiPdAu plating: No exposed copper Surface finish: Uniform stains free & uniform print Cracks: Not visible at x10 Resin holes: not visible at x10 Other: No other visual defect 3.2.3 Scanning acoustic microscopy No delamination. 3.2.4 Microsection Resin holes: no void Glue thickness: conform (min: 11.3m, max 11.8m) Glue voids: no void Die tilt: conform (0.5m) Die scribing: conform NiPdAu plating thickness: conform Package alignment : conform 3.2.5 Decapped devices Loop height: conform Ball size variation: conform Bond shape: conform: Bond centering: conform Weld shape: conform Weld centering: conform Die scribing: conform Die chipping: conform
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Process Change/ Transfer Qualification report n QASO8N91
3.2.6 External dimension measurement Conform 3.2.7 Solderability Conform (both after 24h steam aging and 24 hours dry air) on 80 units 3.3 FINAL TEST QUALIFICATION TL431CD 99.75% LM358D 99.91
Test Yield
3.4 Reliability qualification results
Test TMC TMSK PPT Conditions -65/+150C -65/+150C 121C, 2atm. Duration 1000 cy 500 shks 480 hours
Steps 100cy 1000cy 100 shks 500shks 168h 240h 480h 100cy 48h 168 1000h 168 1000h
Envir. Sequ. HTB THB RSM 245C RSM 260C
TMC + PPT 125C 85C, 85%HR
100cy + 48h 1000 h 1000 h
Lot 1 TL431CD 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/20 + 0/15 0/20
Lot 2 LM358D 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/15
Lot 3 TL082CD 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/78 0/60 0/60 0/60 0/60 0/20 0/20
Test marked in blue performed in ST Muar 3.4.1 Drift analysis HTB (mean Vref drift) TL431CD THB (mean Vref drift) TL431CD HTB (mean Vio drift) LM358D THB (mean Vio drift) LM358D HTB (mean Vio drift) TL082CD THB (mean Vio drift) TL082CD 168h 2.57mV 0.54mV 0.047mV -0.01mV 0.32mV 0.20mV 1000 1.88mV 1.17mV 0.108 0.05 0.29mV 0.15mV
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Process Change/ Transfer Qualification report n QASO8N91
PROCESS CHANGE QUALIFICATION CERTIFICATE (7420046)
PROCESS or PACKAGE: SO8 NRS NiPdAu preplated frame qualification
PLANT: Muar Malaysia
CERTIFICATE NUMBER GROUPS INVOLVED DIVISION INVOLVED TRANSFER TO PLANT TRANSFER FROM PLANT
C212SON1 DSG Standard linear IC's
DESIGN RULE MANUAL PROCESS FMEA PROCESS FLOW CHART PROCESS CONTROL PLAN PARAMETRIC TESTING DOCUMENTATION WLR RELIABILITY REPORT CONSTRUCTION ANALYSIS REPORT ASSEMBLY REPORT QUALIFICATION REPORT TEST VEHICLE PROCESS TEST VEHICLE PACKAGE TEST VEHICLE SALES TYPE Approval Group DSG PROD.ENG. STD LINEAR DSG PROD.ENG. MANAGER STD LINEAR DSG QUALITY MANAGT GNB QA DIRECTOR ST MUAR
0018063 7141456 7124337 7124337 N/A N/A QASONIP1 NO 09/02 Muar ASM PPF Qual. run QASONIP1 Bipolar SO8 TL0431CD, LM358D, TL082CD
Name N ATHALIE BANCHERI ALAIN CHASSAGNEUX FRANCOISE PACCARD RICHARD WONG
Date 24-DEC-2002 20-DEC-2002 07-JAN -2003 24-DEC-2002
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Process Change/ Transfer Qualification report n QASO8N91
APPENDIX 1
INFRARED REFLOW SOLDERING
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Information furnished is believed to be accurate and reliable . However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties, which may result from it's use. No license is granted by implication or otherwise under any patents or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorised for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics c 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hongkong - India - Israel - Italy - Japan - Malaysia - Malta - Morroco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States http://www.st.com
2003/02/7

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